The laser device has the best beam quality for processing of the smallest holes and cutting kerfs, and also high pulse rates for machining large workpiece thicknesses. Focal diameter and position of the workpiece are independent of programmed laser output and pulsed sequence. This guarantees constant machining quality.
| Laser device |
HL 101 P |
| Average Power1 [W] |
80 |
| Max. pulse power [kW] |
8 |
| Max. pulse energy [J] |
8 |
| Pulse duration [ms] |
0.08 –1.0 |
| Beam quality [mm•mrad] |
4 |
| Min. diameter laser light cable [µm] |
100 |
1 At workpiece, controlled over entire life of lamps, depending on pulse duration and pulse setting.
Subject to technical modifications.
|
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