Precision down to the smallest detail

TRUMPF provides new laser beam sources for the growing micro processing market

The TruMicro 7050 features an outstanding productivity for ablative micro processing tasks. Based on disk laser technology, the newest TRUMPF micro processing laser covers applications requiring high average output powers and micro second pulses. These short pulses are generated using Q-switch technology. Delivering more than 500 W, the TruMicro 7050 provides high output power while maintaining a high beam quality of 4 mm*mrad. Thus making this laser perfect for highly productive remote cutting, drilling and ablation processes. Its scanner connection also allows the TruMicro 7050 to process complex shapes. This is opening up a wide variety of applications, such as edge delamination of thin film solar cells and preparing coated, tailored blanks for welding. The beam is transported from the laser to the workpiece via a laser light cable, a feature that lets you easily integrate the unit into systems.

A name for successful micro processing

TruMicro is the new, unified product name used at TRUMPF for its micro processing lasers. "The laser sources in the TruMicro series are TRUMPF's way of responding to the growing demand for lasers that can be used in micro processing applications," explains Dr. Sascha Weiler, product manager for micro processing within the TRUMPF Laser Technology business field. "These micro processing lasers make it possible to continue improving today's applications while opening up still further uses."

Industrial micro processing lasers must meet established standards for reliability and availability and, if they are to deliver cost-effective rates of material removal, must also provide high levels of ablation speeds and powers. TRUMPF’s TruMicro series lasers are especially suited to meeting these increased demands on short and ultrashort pulsed lasers. Their high pulse-to-pulse, output and pointing stability gives them a key advantage, and TRUMPF aims to ensure laser parameters have maximum reproducibility and stability.

New opportunities with ultrashort pulses

TRUMPF will launch a ps laser on the market that, at 50 W, promises to deliver significantly more average power than available lasers have been able to generate up until now. The TruMicro 5050 is suitable for performing micro drilling, cutting and structuring sequences with no need for postprocessing. Laser structuring of thin-film solar cells is only one example of various applications.

The TruMicro 5050 delivers peak pulse outputs of up to 50 MW; the pulse repetition rate is 200 kHz at a pulse duration of less than 10 ps. With its ability to produce ps pulses, the TruMicro 5050 supplements both the TruMicro 7050 and the TruMicro 3040 and 3140 nanosecond lasers.

Proven nanosecond pulses

The TruMicro Series 3000 – proven effective in industrial applications – contains Q-switched solid-state lasers that meet the highest stability and beam quality demands. The TruMicro 3040 delivers 40 W of output, which is twice as high as that produced by its predecessor. This model, which offers a pulse repetition rate between 8 and 70 kHz and pulse duration between 28 and 120 ns, works with an Nd:YLF crystal, making it possible to generate especially high pulse energies of over 4 mJ at 8 kHz. The TruMicro 3140 has an Nd:YVO4 crystal and generates a maximum pulse energy of 1.5 mJ; while its repetition rates lie between 20 and 200 kHz. Applications for these beam sources include precise drilling and ablation of an extremely wide variety of materials.

With its TruMicro series, TRUMPF provides lasers for practical micro processing applications, generating average powers between 40 and 500 W with pulse durations falling within the pico to microsecond range. As a global leader in industrial laser technology and laser systems, TRUMPF prides itself on meeting the most sophisticated demands for quality and reliable customer service.

Further Information
TRUMPF is a high-technology group with focuses in production, laser and medical technology.
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