Laser marking semiconductor materials and precision processing with TruMicro and TruMark |
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| The TRUMPF Group will show customized laser applications for the semiconductor, electronics and photovoltaic industry at the Semicon Europe trade show. The true star of the show is TRUMPF’s new TruMark Series 6000. With an additional head module containing two marking heads called the Dual Head System, the laser can mark twice as fast. By achieving a marking speed of up to 2,800 characters per second and with a character size of up to 1 millimeter, the Dual Head System is setting new standards for marking traditional semiconductor packing material. The system’s features include adjustable power distribution for identical marking results and a maximum positioning accuracy on both marking fields. The TruMark Series 6000 has an output gain of up to 75 percent compared to its predecessor models from the VectorMark compact product line. This shortens processing times, thereby increasing productivity. The TruMark Series 6000 also offers higher pulse peak outputs and higher pulse energies than the VectorMark compact series allowing for new applications and opening up new areas for laser marking. This is due to the fact that the laser aggregates of the TruMark Series 6000 come with all three wavelengths that are normally used for labeling. The basic version of the TruMark laser marker emits light in the infrared range at 1064 nanometers; for processing plastics and semiconductor materials, lasers with green (532 nm) and ultraviolet light (355 nm) are available. The UV wavelength in particular opens up new areas of application for laser marking. This short-wave light reacts directly with the composite materials without heating them up and consequently damaging them. With critical materials especially, these lasers achieve a much greater high-contrast marking quality and higher processing speed. The lasers in the TruMark Series 6000 are also equipped with a digital scanner. This allows for a new, precise generation of deflection systems that makes it possible to convert higher laser powers into a shortened marking time. Laser micro-processing of the finest quality Using short-pulsed lasers from the TruMicro series, semiconductor wafers can be cut or edges from crystalline solar cells can be isolated. Even when it comes to conducting the front contacts to the reverse side through the silicon wafer, the TruMicro lasers are the ideal tool. Depending on the thickness of the wafer, the TruMicro 3040 creates several thousand of the necessary drilling holes in the required cycle times. Along with the TruMicro 7050, TRUMPF offers solutions for automating the process of edge deleting semiconductor modules with the highest reliability and productivity. The edge areas of the coated surfaces are removed to prepare them for lamination with a second glass substrate and to protect the coated surfaces from short circuits and environmental influences. Depending on the coating system, the TruMicro 7050 achieves ablation rates of up to 20–50 cm2 per second when isolating edges. In the field of photovoltaics, lasers from the TruMark Series 6000 are ideal for use in thin-layer solar technology. With a wavelength of 532 nm or 1064 nm, they have sufficient average power for P1–P3 structures having a high feed speed. As with all TRUMPF lasers, the TRUMPF TelePresence Portal offers convenient and secure maintenance worldwide. |
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