For a long time, very few people had ever heard of structuring and ablation with solid -state lasers. The rise in the popularity of microprocessing, however, has focused more attention on these processes. The reason for this is simple: both processes make it possible to machine workpieces in small and ultrasmall dimensions.

Structuring

produces uniformly arranged geometries in surfaces with the goal of inducing specific changes to the surface’s technical properties. In such structures, one single element often measures only a few micrometers.

Laser ablation

is usually used in the manufacture of tools and molds as well as in electronics and semiconductor technology. In injection molding, for example, lasers produce highly detailed, three -dimensional molds into which resin is injected for creating plastic parts. The laser, however, can also be used to trim resistors or mark parts by selectively removing thin layers of material.